The present invention relates to a semi-reflective film
and a reflective film for an optical information recording medium which has a high
cohesion resistance, high light resistance, and high heat resistance simultaneously
with a high reflectivity, high transmissivity, low absorptivity, and high thermal
conductivity in the field of optical information recording media such as compact
disc (CD), digital versatile disc (DVD), Blu-ray Disc, and HD DVD. It also relates
to a sputtering target for an optical information recording medium which is used
in depositing the semi-reflective filmor reflective film; and an optical information
recordingmedium having the semi-reflective film or reflective film.
Optical information recording media (optical discs) include
various types, and the three main types categorized by the writing/reading system
are read-only, write-once, and rewritable optical discs. In order to increase storage
capacity, single side, multilayer optical discs have also been developed from the
ordinary single side, single layer optical discs. For example, in the case of a
single side, dual layer optical disc wherein the signals are written and read in
the recording layer which is farther from the side of the laser beam incidence,
the laser beam should be transmitted through the recording layer which is nearer
to the laser beam incidence, reflected by the farther recording layer, and again
transmitted through the recording layer which is nearer to the laser beam incidence.
Accordingly, a semi-reflective film capable of reflecting and transmitting the laser
beam is used for the recording layer which is nearer to the laser beam incidence.
Materials which function as a semi-reflective film include
metals such as Ag, Al, Au, Pt, Rh and Cr and elemental semiconductors such as Si
and Ge. Among these, pure Ag and Ag alloys containing Ag as their main component
are featured in view of (1) high light efficiency (i.e., the total of reflectivity
and transmissivity), (2) high reflectivity for the blue-violet laser (wavelength:
405 nm) used in Blu-ray Disc and HD DVD, and (3) high thermal conductivity which
enables adequate diffusion of the heat generated in the recording film upon recording
of the signals. Such Ag based materials exhibit excellent properties for use as
a semi-reflective film of an optical disc including high reflectivity, high transmissivity,
low absorptivity, and high thermal conductivity. In this connection, the absorptivity
is determined according to the following equation: absorptivity = 100% - (reflectivity
+ transmissivity). However, in order to accomplish sufficient function as a semi-reflective
film of an optical disc with long term reliability, the Ag based materials need
to overcome the disadvantages of the Ag based materials, namely, (1) cohesion resistance,
(2) light resistance and (3) heat resistance.
[1] Cohesion resistance
Ag based materials are likely undergo cohesion under the
effect of heat and/or a halogen such as fluorine, chlorine, bromine or iodine. When
it is kept under high temperature, high humidity conditions used in the reliability
test of an optical disc, or arranged in contact with a halogen-containing organic
material typically of the organic dye recording film, the protective layer or the
adhesive layer, cohesion may take place, resulting in the increase in the surface
roughness of the thin film or loss of the continuity of the thin film, which may
in turn invite loss of the function of the material as a semi-reflective film or
a reflective film.
[2] Light resistance
For example, a single side, dual layer, read-only optical
disc has a basic cross sectional structure of polycarbonate (PC) substrate \ semi-reflective
film \ adhesive layer \ reflective film \ PC substrate. When such an optical disc
is irradiated by a Xe lamp (a lamp having a spectrum resembling that of the sunlight)
in a so called "light resistance test", the semi-reflective film experiences decrease
in the reflectivity when the film comprises a Ag based material, and in such a case,
reading of the signal becomes impossible once the reflectivity is reduced to below
the threshold value that is required for detecting the signal to be read.
[3] Heat resistance
A single side, dual layer, write-once optical disc, for
example, has a basic cross sectional structure of PC substrate \ recording film
\ semi-reflective film \ spacer \ recording film \ reflective film \ PC substrate,
and a single side, dual layer, rewritable optical disc has a basic cross sectional
structure of PC substrate \ dielectric and protective layer \ interface layer \
recording film \ interface layer \ dielectric and protective layer \ semi-reflective
film \ intermediate layer \ dielectric and protective layer\interface layer\recording
film\ interface layer \ dielectric and protective layer \ reflective film \ PC substrate.
In the case of recordable optical discs including such write-once and rewritable
optical discs, the recording layer is heated to a temperature as high as 300°C
to 600°C during the writing, and a very severe thermal hysteresis is applied
to the semi-reflective film or the reflective film. The growth of the crystal grains
of the thin film and loss of the continuity of the thin film caused as a result
of such thermal hysteresis impair the function of the semi-reflective film and the
reflective film.
Various attempts have been made to improve the pure Ag,
mainly by alloying the Ag. For example, corrosion resistance is improved in
USP 6007889
by adding Au, Pd, Cu, Rh, Ru, Os, Ir or Pt to Ag; in
USP 6280811
, Published Japanese translation of PCT international publication for patent
application 2002-518596, by adding Au, Pd, Cu, Rh, Ru, Os, Ir, Be or Pt to Ag; and
in
USP 5948497
,
Japanese Patent Application Laid-Open No. 06-208732
by adding Pd or Cu to Ag. The inventors of the present invention have
also disclosed in
Japanese Patent No. 3365762
a method for improving crystal structure stability by adding Nd to Ag
wherein the crystal structure stabilized by suppressing Ag diffusion and crystal
grain growth.
EP 1 174 868 A2
describes a silver-based alloy thin film for the highly reflective or
semi-reflective coating layer of optical discs, wherein the alloy additions to silver
include zinc, aluminum, zinc plus aluminum, manganese, germanium, and copper plus
manganese.
In spite of such efforts, no Ag based alloy has been found
that exhibits high reflectivity, high transmissivity, low absorptivity and high
thermal conductivity simultaneously with high cohesion resistance, high light resistance
and high heat resistance, and accordingly, there is a strong demand for a Ag based
alloy which satisfies requirements for all these properties.
The present invention has been completed in view of such
situation, and an object of the present invention is to find a Ag based alloy which
exhibits high cohesion resistance, high light resistance, high heat resistance,
high reflectivity, high transmissivity, low absorptivity and high thermal conductivity
of the level which had not been realized by the pure Ag or by the conventional Ag
alloys, and on the bases of such alloy, to provide a semi-reflective film and a
reflective film for an optical information recording medium having excellent writing/reading
properties and long term reliability; a sputtering target for an optical information
recording medium used in depositing the semi-reflective film and the reflective
film; and an optical information recording medium including the semi-reflective
film or the reflective film. The solution to the above technical problem is achieved
by providing the subject matter defined in the claims.
Specifically, the present invention provides, in a first
aspect, a semi-reflective film or reflective film for an optical information recording
medium containing a Ag based alloy, wherein the Ag based alloy contains 0.01 to
10 atomic percent of Li, and wherein the Ag based alloy further contains 0.005 to
0.8 atomic percent of Bi.
In addition or alternatively, the Ag based alloy can further
contain 0.1 to 2 atomic percent in total of at least one rare earth metal element
selected from the group consisting of Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb,
Dy, Ho, Er, Tm, Yb and Lu.
The rare earth metal element is preferably at least one
of Nd and Y.
The Ag based alloy can further contain 0.1 to 3 atomic
percent in total of at least one element selected from the group consisting of Cu,
Au, Rh, Pd and Pt.
Thepresentinventionprovides, in a second aspect, anoptical
information recording medium having the semi-reflective film of the present invention.
Further, the present invention provides, in a third aspect,
an optical information recording medium having the reflective film of the present
invention.
In a fourth aspect, the present invention provides a Ag
based alloy sputtering target, containing Ag and 0.01 to 10 atomic percent of Li,
and the Ag based alloy sputtering target further contains 0.02 to 8 atomic percent
of Bi.
The Ag based alloy sputtering target can further contain
0.1 to 2 atomic percent in total of at least one rare earth metal element selected
from the group consisting os Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho,
Er, Tm, Yb and Lu.
The rare earth metal element in the target is preferably
at least one of Nd and Y.
The sputtering target can further contain at least one
selected from the group consisting of Cu, Au, Rh, Pd and Pt.
As described above, the semi-reflective film and the reflective
film for an optical information recording medium of the present invention have high
cohesion resistance, high light resistance, and high heat resistance simultaneously
with high reflectivity, high transmissivity, low absorptivity and high thermal conductivity,
and the resulting optical information recording medium will exhibit dramatically
improved writing/reading properties as well as excellent long term reliability.
The sputtering target of the present invention is well adapted for depositing the
above-mentioned semi-reflective film or reflective film, and the semi-reflective
film and the reflective film produced by using the sputtering target are excellent
in the alloy composition, distribution of the alloying element, and uniformity in
the film plane direction, and such film will also enjoy low impurity content, and
therefore, the resulting semi-reflective film or the reflective film will enjoy
high performance, enabling the production of an optical information recording medium
having excellent writing/reading properties and excellent long term reliability.
Furthermore, the optical information recording medium of the present invention will
have remarkably improved writing/reading properties and long term reliability.
Under the above circumstances, the inventors of the present
invention have made intensive investigations to provide a semi-reflective film and
a reflective film comprising a Ag based alloy, which are adapted for use in an optical
information recording medium, and which exhibit high cohesion resistance, high light
resistance and high heat resistance simultaneously with high reflectivity, high
transmissivity, low absorptivity and high thermal conductivity. More specifically,
the inventors deposited various Ag based alloy thin films of various alloy compositions
by sputtering various Ag based alloy sputtering targets, and evaluated these films
for their film composition, cohesion resistance, light resistance, heat resistance,
reflectivity, transmissivity, absorptivity and thermal conductivity. The inventors
then found that the Ag based alloy semi-reflective film and reflective film for
an optical information recording medium containing 0.01 to 10 atomic percent of
Li have excellent cohesion resistance, light resistance and heat resistance, simultaneously
with high reflectivity, high transmissivity, low absorptivity and high thermal conductivity
surpassing those of the films made of the pure Ag or the conventional Ag alloys.
The present invention has been achieved on the bases of such findings.
The inventors of the present invention have demonstrated
that the Ag based alloy thin film containing Li is excellent typically in light
resistance as compared with thin films made of pure Ag and the conventional Ag based
alloys. For example, decrease in the reflectivity for the light irradiated by a
Xe lamp (a lamp having the spectrum resembling the sunlight) takes place, for example,
in a single side, dual layer, read only optical disc having the basic cross sectional
structure of PC substrate \ semi-reflective film \ adhesive layer \ reflective film
\ PC substrate only when the semi-reflective film comprises a Ag based material.
This is a phenomenon caused by diffusion and penetration of the Ag atom constituting
the Ag based semi-reflective film into the adjacent PC substrate and/or adhesive
layer. In the Li-containing Ag based alloy thin film of the present invention, ionization
of Ag due to light irradiation is prevented by preferential ionization of Li, i.e.,
sacrificed protection of Li having a higher ionization tendency than Ag. The light
resistance is thereby improved. In addition, the inventors revealed that the Li-containing
Ag based alloy thin film is an optimal Ag based alloy thin filmhaving not only excellent
light resistance, improved cohesion resistance and improved heat resistance, which
are disadvantages of conventional Ag based materials, and exhibiting high reflectivity,
high transmissivity, low absorptivity and high thermal conductivity, which are advantages
of such Ag based materials.
The Ag based alloy semi-reflective film and reflective
film for an optical information recording medium of the present invention have a
feature that they contain Li in a content of 0.01% to 10% (hereinafter all percentages
are atomic percentages, unless otherwise specified). With an increasing content
of Li, the improvement of the cohesion resistance, the light resistance and the
heat resistance becomes clear but decrease in the reflectivity, the transmissivity
and the thermal conductivity as well as increase in the absorptivity occur. Therefore,
Li is added in a content of 0.01% to 10%. Li content of less than 0.01% is not preferable
since the film will fail to exhibit high cohesion resistance, high light resistance
and high heat resistance, whereas Li content exceeding 10% is also not preferable
since the resulting film will not exhibit high reflectivity, high transmissivity,
low absorptivity and high thermal conductivity. Therefore, the Li content is preferably
0.01% to 10%, more preferably 0.05% to 8%, and further preferably 0.1% to 6%.
Also effective is addition of Bi to the Ag based alloy
semi-reflective film and reflective film of the present invention for further higher
cohesion resistance, heat resistance and corrosion resistance. However, when Bi
is added in a content of less than 0.005%, further improvement in the cohesion resistance,
the heat resistance and the corrosion resistance may not be attained. On the other
hand, addition of such element exceeding 0.8% may not yield high reflectivity, high
transmissivity, low absorptivity and high thermal conductivity. Accordingly, the
Bi content is 0.005% to 0.8%, more preferably 0.01% to 0.6%, and further preferably
0.05% to 0.4%.
Also effective is addition of a total content of 0.1% to
2% of at least one rare earth metal element selected from the group consisting of
Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, and in particular,
at least one of Nd and Y to the Ag based alloy semi-reflective film and reflective
film of the present invention for further improving the cohesion resistance and
the heat resistance. However, when such rare earth element is added in a total content
of less than 0.1%, further improvement in the cohesion resistance and the heat resistance
is not attained. On the other hand, addition of such element in excess of 2% does
not yieldhigh reflectivity, high transmissivity, low absorptivity, and high thermal
conductivity. Accordingly, the total content of such elements is preferably 0.1%
to 2%, more preferably 0.2% to 1%, and further preferably 0.3% to 0.5%.
Also effective is addition of at least one element selected
from Cu, Au, Rh, Pd and Pt to the Ag based alloy semi-reflective film and reflective
film of the present invention for further improving the corrosion resistance. However,
when the at least one element selected from Cu, Au, Rh, Pd, and Pt is added in a
total content of less than 0.1%, further improvement in the corrosion resistance
and the heat resistance is not attained. On the other hand, addition of such element
in excess of 3% does not yield high reflectivity, high transmissivity, low absorptivity,
and high thermal conductivity. Accordingly, such elements are added in a total content
of 0.1% to 3%, preferably at 0.2% to 2%, and further preferably at 0.3% to 1%.
It is to be noted that the Ag based alloy semi-reflective
film for the optical information recording medium of the present invention is a
thin film in a single side, multilayer optical disc which functions to enable transmission
and reflection of the laser beam at the recording layer other than the recording
layer located farthest from the side of the laser beam incidence, and this film
may have a transmissivity of about 45% to 80% and a reflectivity of about 5% to
30%. The thickness may be any adequately determined so that the transmissivity and
the reflectivity are within the predetermined range. The Ag based alloy semi-reflective
film, however, may generally have a film thickness in the range of 5 to 25 nm.
It is to be noted that the Ag based alloy reflective film
for the optical information recording medium of the present invention is a reflective
filmof a single side, single layer optical disc, or the reflective film in a single
side, multilayer optical disc which is the farthest from the side of the laser beam
incidence, and this film may have a reflectivity of about 50% or more and a transmissivity
of substantially 0%. The thickness may be any adequately determined so that the
reflectivity and the transmissivity are within the predetermined range. The Ag based
alloy reflective film, however, may generally have a film thickness in the range
of 50 to 250 nm.
The Ag based alloy semi-reflective film and reflective
film of the present invention are produced by depositing the above-mentioned Ag
based alloy on a substrate by various thin film deposition techniques such as vacuum
deposition, ion plating and sputtering, and the recommended is the one produced
using the sputtering for the film deposition. Compared to the films formed by other
thin film deposition techniques, the Ag based alloy semi-reflective film and reflective
film formed by sputtering are superior in the alloy composition, distribution of
the alloying elements, and uniformity of the film thickness in the film plane, and
hence, in the performance as a semi-reflective film and reflective film (including
high reflectivity, high transmissivity, low absorptivity, high thermal conductivity,
high cohesion resistance, high light resistance and high heat resistance) enabling
the production of an optical information recording medium having excellent writing/reading
properties and long term reliability.
In the sputtering, a reflective film of desired alloy composition
can be deposited by using a sputtering target (hereinafter simply referred as "target")
comprising a Ag based alloy containing 0.01% to 10% of Li. The Li content of the
target is 0.01% to 10%, preferably 0.05% to 8%, and more preferably 0.1% to 6%.
To deposit a Ag based alloy semi-reflective film or reflective
film further comprising 0.005% to 0.8% of Bi, the target should further contain
0.02% to 8%, preferably 0.1% to 6%, and more preferably 0.2% to 4% of Bi. The Bi
content in the target is higher than the Bi content in the semi-reflective film
or reflective film since the amount of Bi in the resulting semi-reflective film
or reflective film reduces to several to several dozen percent of the Bi that had
been present in the target in the course of film deposition by sputtering using
the target comprising the Bi-containing Ag based alloy. Such decrease is estimated
to have been caused by re-evaporation of the Bi from the film surface in the course
of the film deposition due to the substantial difference in the melting point between
the Ag and the Bi; difficulty of sputtering Bi due to higher sputtering rate of
the Ag compared to that of the Bi; and oxidation of only Bi on the target surface
due to higher reactivity of the Bi compared to the Ag. The substantial decrease
of the Bi content of the reflective film from that of the target is a phenomenon
that is not found in other Ag based alloy such as Ag-rare earth metal alloy. Accordingly,
Bi content in the target should be increased compared to that of the Bi in the semi-reflective
film or reflective layer to be deposited.
When 0.1% to 2% of at least one rare earth metal element
selected from Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and
Lu, and in particular, at least one of Nd and Y is to be further added to the semi-reflective
film or reflective film, these elements may be added to the target. The rare earth
metal element, and in particular, the at least one of Nd and Y may be added in a
total content of 0.1% to 2%, preferably 0.2% to 1%, and more preferably 0.3% to
0.5%.
When 0.1% to 3% of at least one element selected from Cu,
Au, Rh, Pd and Pt is to be added to the semi-reflective film or reflective film,
these elements may be added to the target. The at least one element selected from
Cu, Au, Rh, Pd and Pt may be added in a total content of 0.1% to 3%, preferably
0.2% to 2%, and more preferably 0.3% to 1%.
The Ag based alloy sputtering target of the present invention
can be produced by any method including melting and casting, powder sintering, and
spray forming, and among these, the preferred is the one produced by vacuum melting
and casting since the Ag based alloy sputtering target produced by vacuum melting
and casting contains less nitrogen, oxygen and other impurities, and the semi-reflective
film and the reflective film produced by using such sputtering target efficiently
exhibit excellent properties, such as high reflectivity, high transmissivity, low
absorptivity, high thermal conductivity, high cohesion resistance, high light resistance
and high heat resistance, to enable production of an optical information recording
medium having excellent writing/reading properties and long term reliability.
The optical recording medium of the present invention is
not particularly limited for its constitution as an optical information recording
medium, as long as it has the Ag based alloy semi-reflective film and/or the Ag
based alloy reflective film of the present invention, and any constitution known
in the field of the optical information recording medium may be employed. For example,
the semi-reflective filmor the reflective filmcomprising the Ag based alloy as described
above have high reflectivity, high transmissivity, low absorptivity, high thermal
conductivity, high cohesion resistance, high light resistance andhighheat resistance,
and therefore, these films are well adapted for use in the current read-only, write-once,
and rewritable optical information recording media as well as next-generation, high
storage capacity optical information recording media.
The present invention will be described in further detail
with reference to the following experimental examples which by nomeans limit the
scope of the present invention. Anymodification of such examples without deviating
the scope of the present invention is within the technical range of the present
invention.
(1) Deposition of thin film
By using sputtering targets, sample thin films (Sample
Nos. 1 to 139) were each deposited on a polycarbonate substrate (with a diameter
of 50 mm and a thickness of 1.0 mm) in a sputtering apparatus HSM-552 manufactured
by Shimadzu Corporation by DC magnetron sputtering at a base pressure of 0.27 x
10-3 Pa or less, an Ar gas pressure of 0.27 Pa, an Ar gas flow rate of
30 sccm, a sputtering power of DC 200 W, a distance between the target and substrate
of 52 mm and a substrate temperature of room temperature. The sputtering targets
used herein are a pure Ag sputtering target (with a diameter of 101.6 mm and a thickness
of 5 mm), a Ag-Li alloy sputtering target (with a diameter of 101.6 mm and a thickness
of 5 mm), a Ag-Li-Bi alloy sputtering target (with a diameter of 101. 6 mm and a
thickness of 5 mm), a composited sputtering target (with a diameter of 101.6 mm
and a thickness of 5 mm) comprising the Ag-Li alloy sputtering target or the Ag-Li-Bi
sputtering target and a predetermined number of the chips (with a width of 5 mm,
a length of 5 mm and a thickness of 1 mm) of an alloying element (Nd, Y, Cu or Au)
arranged on the Ag-Li alloy sputtering target or the Ag-Li-Bi sputtering target,
or a Ag alloy sputtering target (with a diameter of 101. 6 mm and a thickness of
5 mm). The sample thin films for the analysis of the film composition, and the evaluation
of cohesion resistance (cohesion caused by heat, and cohesion caused by a halogen),
heat resistance and thermal conductivity had a thickness of 100 nm, corresponding
to the thickness of a reflective film used in an optical information recording medium.
The sample films for the evaluation of the light resistance, reflectivity, transmissivity
and absorptivity had a thickness of 15 nm, corresponding to the thickness of a semi-reflective
film used in an optical information recording medium.
(2) Analysis of the film composition
Of the thus deposited thin films, Ag alloy thin films (Sample
Nos. 2 to 139) were analyzed for their film composition by inductively coupled plasma
(ICP) mass spectroscopy. More specifically, analysis was conducted by dissolving
an analyte Ag alloy thin film in an acid solution (nitric acid : pure water = 1:1),
heating the acid solution on a hot plate of 200°C, cooling the solution to
room temperature after confirming that all analyte sample had dissolved in the acid
solution, and measuring the amount of alloying element in the Ag alloy thin film
by using ICP mass spectrometer SPQ-8000 manufactured by Seiko Instrument Inc. The
analyzed film compositions of the samples are shown in Table 1 together with the
results of the film structure analysis and evaluation of various properties in Tables
2 to 7 as described below.
Table 1
(3) Evaluation of light resistance
Samples wherein the thus deposited thin films (Sample Nos.
1 to 139) was overlaid with a UV curable resin film were subjected to determination
of their spectral reflectivity and spectral transmissivity at wavelengths of 400
to 800 nm using by using UV-Vis-NIR spectrophotometer V-570DS manufactured by JASCO.
The samples were then subjected to UV/visible light irradiation test using Super
Xenon Fading Apparatus SX75F manufactured by Suga Test Instruments Co., Ltd., wherein
the samples were irradiated with UV/visible light at an illuminance of 120 W/m2,
a temperature of 80°C for 144 hours by a xenon arc lamp, and the spectral reflectivity
and spectral transmissivity were determined after the test. The results of the evaluation
for the light resistance are shown in Table 2.
Table 2
In Table 2, a sample with a change in reflectivity to laser
beam with a wavelength of 405 nm typically used in Blu-ray Disc and HD DVD between
before and after the irradiation test of less than 1% was regarded to have high
light resistance and evaluated as "A", and a sample with the change of 1% or more
was regarded to have low light resistance and evaluated as "B".
Table 2 shows that the Ag thin film (Sample No. 1), the
Ag-Au thin film (Sample No. 2), the Ag-Pd thin film (Sample No. 3) and the Ag-Pt
thin film (Sample No. 4) fail to exhibit high light resistance.
In contrast, the thin films of Sample Nos. 5 to 139 exhibit
high light resistance due to incorporation of Li. The effects of adding Rh, Pd and
Pt are equivalent to the addition of Cu and Au.
(4) Evaluation of cohesion resistance (cohesion caused by heat)
The thus deposited thin films (Sample Nos. 1 to 139) were
measured for average surface roughness Ra by using Nanoscope IIIa scanning probe
microscope manufactured by Digital Instruments in an atomic force microscope (AFM)
observation mode. These thin films were subjected to high temperature, high humidity
test at a temperature of 80°C and relative humidity of 90%RH for 48 hours,
and the average surface roughness Ra was measured again after this test. The results
of the evaluation for the cohesion resistance (cohesion caused by heat) are shown
in Table 3.
Table 3
In Table 3, a sample with a change in average surface roughness
between before and after the high temperature, high humidity test of less than 1.5
nm was regarded to have high cohesion resistance, and was evaluated as "A", and
a sample with a change in average surface roughness of 1.5 nm or more was regarded
to have no such high cohesion resistance and was evaluated as "B".
As demonstrated in Table 3, all Ag alloy thin films containing
Li (Sample Nos. 5 to 139) exhibit high cohesion resistance, and those not containing
Li, namely, the Ag thin film (Sample No. 1), the Ag-Au thin film (Sample No. 2),
the Ag-Pd thin film (Sample No. 3) and the Ag-Pt thin film (Sample No. 4) fail to
show such high cohesion resistance. The effects of adding Rh, Pd, and Pt are equivalent
to the addition of the Cu and Au.
(5) Evaluation of cohesion resistance (cohesion caused by a
halogen)
The thus deposited thin films (Sample Nos. 1 to 139) were
measured for average surface roughness Ra by using Nanoscope IIIa scanning probe
microscope manufactured by Digital Instruments in an atomic force microscope (AFM)
observation mode. These thin films were subjected to salt water immersion test at
a salt water concentration (NaCl concentration) of 0.05 mol/l, a salt water temperature
of 20°C, and an immersion time of 5 minutes, and the average surface roughness
Ra was measured again after this test. The results of the evaluation for the cohesion
resistance (cohesion caused by a halogen) are shown in Table 4.
Table 4
In Table 4, a sample with a change in average surface roughness
between before and after the salt water immersion test of less than 3 nm was regarded
to have a high cohesion resistance and was evaluated as "A", and a sample with a
change in average surface roughness of 3 nm or more was regarded to have no such
high cohesion resistance and was evaluated as "B".
As demonstrated in Table 4, the Ag-Au thin film (Sample
No. 2), the Ag-Pd thin film (Sample No. 3), the Ag-Pt thin film (Sample No. 4),
and the Ag alloy thin films containing Li(Sample Nos. 5 to 139) exhibit high cohesion
resistance, and the Ag thin film (Sample No. 1) fails to show the high cohesion
resistance. The effects of adding Rh, Pd, and Pt are equivalent to the addition
of the Cu and Au.
(6) Evaluation of heat resistance
The thus deposited thin films (Sample Nos. 1 to 139) were
measured for average surface roughness Ra by using Nanoscope IIIa scanning probe
microscope manufactured by Digital Instruments in an atomic force microscope (AFM)
observation mode. These thin films were subjected to vacuum heating test at a degree
of vacuum of 0.27 x 10-3 Pa or less and a temperature of 300°C for
0.5 hour using a heat treatment apparatus in rotary magnetic field manufactured
by Naruse Scientific Machines, and the average surface roughness Ra was measured
again after this test. The results of the evaluation for the heat resistance are
shown in Table 5.
Table 5
In Table 5, a sample with a change in average surface roughness
between before and after the vacuum heating test of less than 1.5 nm was regarded
to have an excellent heat resistance and was evaluated "A", a sample with a change
in average surface roughness of 1.5 nm or more and less than 3.0 nm was regarded
to have a high heat resistance and was evaluated as "B", and a sample with a change
in average surface roughness of 3.0 nm or more was regarded as the one not having
such high heat resistance and was evaluated as "C".
The Ag thin film (Sample No. 1), the Ag-Au thin film (Sample
No. 2), the Ag-Pd thin film (Sample No. 3) and the Ag-Pt thin film (Sample No. 4)
fail to exhibit high heat resistance.
In contrast, the thin films of Sample Nos. 5 to 139 exhibit
high heat resistance. Among them, the thin films containing at least one of Nd and
Y show further high heat resistance. The effects of adding Rh, Pd, and Pt are equivalent
to the addition of Cu and Au.
(7) Evaluation of reflectivity, transmissivity and absorptivity
The thus deposited thin films (Sample Nos. 1 to 139) were
measured for spectral reflectivity and spectral transmissivity at wavelengths of
400 to 800 nm by using UV-Vis-NIR spectrophotometer V-570DS manufactured by JASCO,
and absorptivity was calculated from the measured reflectivity and the transmissivity
according to the following equation:
The results of the evaluation for the reflectivity, the
transmissivity, and the absorptivity for the laser beam with the wavelength of 405
nm typically used in Blu-ray Disc and HD DVD are shown in Table 6.
Table 6
In Table 6, the sample having a reflectivity of 15% or
more, a transmissivity of 60% or more, and an absorptivity of less than 25% in relation
to the reflectivity of 18%, the transmissivity of 68%, and the absorptivity of 14%
of the pure Ag was regarded as the one having excellent optical properties, and
such sample was evaluated "A", and the sample having a reflectivity of less than
15%, a transmissivity of less than 60%, and an absorptivity 25% or more was regarded
as the one not having the excellent optical properties, and such sample was regarded
as "B".
The Ag-16%Li thin film (Sample No. 8) fails to show high
reflectivity, high transmissivity and low absorptivity due to its excessively high
Li content.
In contrast, the other sample thin films exhibit high reflectivity,
high transmissivity and low absorptivity. The effects of adding Rh, Pd and Pt are
equivalent to the addition of the Cu and Au.
(8) Evaluation of thermal conductivity
The thus deposited thin films (Sample Nos. 1 to 139) were
measured for thermal conductivity by the procedure as described below. Namely, thermal
conductivity was determined by measuring the sheet resistance Rs by DC four-probe
technique using 3226 m&OHgr; Hi TESTER manufactured by HIOKI E. E. CORPORATION;
measuring the film thickness t using alpha-step 250 manufactured by TENCOR INSTRUMENTS;
calculating the electrical resistivity &rgr; (µ&OHgr;cm) according to the
following equation: &rgr; = sheet resistance Rs x film thickness t; and then,
calculating the thermal conductivity &kgr; (W/(m·K)) at an absolute temperature
of 300K (ca. 27°C) by Wiedemann-Franz law according to the following equation:
&kgr; = 2.51 x (absolute temperature T)/(electrical resistivity &rgr;). The
results of the evaluation for the thermal conductivity are shown in Table 7.
Table 7
In Table 7, a sample having a thermal conductivity of 160
W/(m·K) or more corresponding 50% or more of 320W/(m·K), the thermal conductivity
of the pure Ag thin film, was regarded to have excellent thermal conductivity and
was evaluated "A", and a sample having a thermal conductivity of less than 160 W/(m·K)
was regarded as the one not having the excellent thermal conductivity and was regarded
as "B".
The Ag-16%Li thin film (Sample No. 8) fails to show high
thermal conductivity due to its excessively high Li content.
In contrast, the other sample thin films exhibit high thermal
conductivity. The effects of adding Rh, Pd, and Pt are equivalent to the addition
of the Cu and Au.
While the present invention has been described with reference
to what are presently considered to be the preferred embodiments, it is to be understood
that the invention is not limited to the disclosed embodiments. On the contrary,
the invention is intended to cover various modifications and equivalent arrangements
included within the spirit and scope of the appended claims. The scope of the following
claims is to be accorded the broadest interpretation so as to encompass all such
modifications and equivalent structures and functions.
In the following Tables 1 to 7, Examples 1-8, 10-13, 18-21,
26-30, 51-118 and 128-133 represent Comparative Examples.